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Universal BGA reballing stencil template grid for DDR, SSD, and NAND flash memory IC chips.
Universal BGA reballing stencil template grid for DDR, SSD, and NAND flash memory IC chips.
Universal BGA reballing stencil template grid for DDR, SSD, and NAND flash memory IC chips.
Universal BGA reballing stencil template grid for DDR, SSD, and NAND flash memory IC chips.
Universal BGA reballing stencil template grid for DDR, SSD, and NAND flash memory IC chips.

BGA Reballing Stencil for DDR, SSD, and NAND Memory ICs (10Pcs)

Price range: $23.00 through $24.00

This metal mesh template is constructed to align solder paste directly onto memory chips for motherboard repairs. Utilizing this High-Quality BGA Memory IC Reballing Stencil allows technicians to properly map connection points and secure components.
SKU: RT-00019
Primary Category: REPAIR TOOLS

Shipping: 5 - 9 days

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Product Specifications

General

SKU
RT-00019
Brand
Universal
Material
Combination of Materials

Additional Details

Compatibility
  • BGA96, BGA132, BGA136, BGA152, BGA272, BGA316, BGA100
  • BGA78, BGA82, BGA102, BGA154, BGA178, BGA291
  • DDR3, DDR4, DDR5, LPDDR, and GDDR RAM particles
  • SSD NAND Flash memory chips
  • Solid State Drive (SSD) and U-Disk master control ICs

NOTE: Please verify your device's model number to ensure that this part is compatible.
Whats in the box
BGA Reballing Stencil

Description

The template for microchips is responsible for aligning solder paste during motherboard work. If the repair process shows bridged solder joints, uneven pad connections, or failed chip placement, the current mesh may be faulty. Switching to this Precision BGA Memory IC Reballing Stencil provides a direct structural answer. It maps out the exact grid layout and returns the repair workflow to proper standard operation.

Key Benefits:

  • Aligns solder paste directly onto DDR, SSD, and NAND chips.
  • Prevents bridged connection pads during motherboard rework.
  • Resists warping under standard heating plate temperatures.
  • Matches exact pad layouts for memory IC modules.
  • Delivers a flat surface for uniform paste application.

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